JT Baker® 5525-09 CLk™-168 Post-Ash Residue Remover, ALEG Grade, 455Lb Poly Drum
- Residue remover is designed to increase margin for line collapse in dense arrays and high-aspect ratio layouts. Aqueous-based post-etch remover.
- Broad process latitude in multiple technology nodes from 130 nm and below. Significantly longer bath life over competitive formulations in conventional cleans.
- Compatibility with copper, dense and low-ĸ materials. DI Water Rinse Designed for used in bath, batch spray an single-wafer tools.
- Excellent cleaning of silicon, copper oxide, titanium fluoride rich residues
- Short operating times—15 to 90 seconds for a single wafer process. Low operating temperatures—starting at 25˚C.
- 455Lb Poly Drum
- Manufacturer Part No: JT-5525-09
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Details
JT Baker® CLk™-168 Post-Ash Residue Remover
JT Baker® CLk™-168 post-ash residue remover, as with all products from the J.T.Baker®, the CLk™ series, offers increased process margins for post-etch residue removal and sacrificial layer removal. The CLĸ™ Series of materials also allows consolidation of wet chemistries and the removal of process operations, lowering the cost of ownership for wet process.
JT Baker® CLĸ™-168 residue remover is designed to increase margin for line collapse in dense arrays and high-aspect ratio layouts. This product offers significantly longer bath life over competitive formulations in conventional cleans.
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JT Baker® CLk™-168 Post-Ash Residue Remover
JT Baker® CLk™-168 post-ash residue remover, as with all products from the J.T.Baker®, the CLk™ series, offers increased process margins for post-etch residue removal and sacrificial layer removal. The CLĸ™ Series of materials also allows consolidation of wet chemistries and the removal of process operations, lowering the cost of ownership for wet process.
JT Baker® CLĸ™-168 residue remover is designed to increase margin for line collapse in dense arrays and high-aspect ratio layouts. This product offers significantly longer bath life over competitive formulations in conventional cleans.