KMG Electronic Chemicals 041231 Ultra-Etch® NP 7:1, Buffered Oxide Etchant Without Surfactant, 1 Gallon Poly Bottle with Vented Cap (Case of 4)
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- Assay (HF): 6.23 to 6.40%
- Assay (NH4F): 34.3 to 35.3%
- Surface Tension: 23 Dynes/cm
- 0.5μ Particle Count: 200 Par/mL; 1.0μ Particle Count: 20 Par/mL
- Trace impurities measured in PPB. See "Documents" sub-tab below for "Product Datasheet" link.
- Case of 4 x 1 Gallon Poly Bottles with Vented Caps
- Manufacturer Part No: 41231
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Details
Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends. 4 x 1-Gallon Poly Bottles/Case. KMG Item#: 041231.
Documents & Videos
Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends. 4 x 1-Gallon Poly Bottles/Case. KMG Item#: 041231.