KMG Electronic Chemicals 040889 Ultra-Etch® NP 6:1 With Surfactant, Buffered Oxide Etchant, 4x1-Gallons/Case

Notice: Hazardous chemicals and products will incur additional Hazmat Fees and/or mandatory shipment via LTL Motor Freight
  • Assay (HF): 7.13 to 7.33%
  • Assay (NH4F): 33.6 to 34.6%
  • Color (APHA): 10; Surface Tension: 23 Dynes/cm
  • 0.5μ Particle Count: 100 Par/mL; 1.0μ Particle Count: 20 Par/mL
  • Trace impurities measured in PPB. See "Documents" sub-tab below for "Product Datasheet" link.
  • 4 x 1-Gallon Poly Bottles/Case (Vented Caps)
  • Manufacturer: KMG Electronic Chemicals
  • Manufacturer Part No: 40889
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Item Number: KMG-040889

Details

Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends. 4x1Gallons/Case. Ultra Utch NP 6:1 Buffered Oxide Etch with Surfactant. Cases Only.

Documents

Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends. 4x1Gallons/Case. Ultra Utch NP 6:1 Buffered Oxide Etch with Surfactant. Cases Only.

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