KemLab™ HARP™-C0.4-CS MMA-MAA Copolymer e-Beam Positive Photoresist, 0.4um Film Thickness (Case of 4 x 4L Bottles)

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  • Photoresist Tone: Positive
  • ~Film Thickness: 0.4 microns at 2000rpm; ~Viscosity (cst): 18.
  • Applications: e-Beam Direct Write Lithography, T-Gate Manufacture, X-Ray LIGA, Wafer Thinning
  • MMA/MAA Copolymer (methyl methacrylate/methacrylic acid); Manufactured in Ethyl Lactate; Used in multi-layer process with PMMA (polymethyl methacrylate)
  • Competes with 8.5 MAA EL 9
  • Case of 4 x 4L Bottles
  • Manufacturer Part No: HARP-C0.4-CS
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Item Number: KEM-HARP-C-0.4-CS

Details

KemLab™ HARP™-C MMA-MAA copolymer e-Beam positive photoresist is designed for high resolution direct write e-Beam lithography. When combined with either KemLab™ 500 HARP™ or KemLab™ 1000 HARP™ PMMA photoresist, the HARP™ multi-layer system is ideal for T-gate manufacture. HARP™-C has excellent adhesion to a wide variety of substrates, and is used as a protective coating layer for wafer thinning and sacrificial layers. KemLab™ HARP™-C PMMA copolymer e-Beam positive photoresist is manufactured with ethyl lactate.

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KemLab™ HARP™-C MMA-MAA copolymer e-Beam positive photoresist is designed for high resolution direct write e-Beam lithography. When combined with either KemLab™ 500 HARP™ or KemLab™ 1000 HARP™ PMMA photoresist, the HARP™ multi-layer system is ideal for T-gate manufacture. HARP™-C has excellent adhesion to a wide variety of substrates, and is used as a protective coating layer for wafer thinning and sacrificial layers. KemLab™ HARP™-C PMMA copolymer e-Beam positive photoresist is manufactured with ethyl lactate.

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