KemLab™ KL1602 Negative Lift Off Photoresist, 2 to 4um Film Thickness, 1L Bottle

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  • Designed for use with industry standard developers
  • Film Thickness Range: 2 to 4 microns. ~Viscosity (cst): 25. Improved resolution. Wider Process Latitude.
  • Wide process window for consistency across substrates, while still retaining ability to adjust resist profile
  • Soft-bake on contact hotplate: 110°C for 60 seconds
  • KL1602 is suitable for i-Line and broadband exposure
  • 1L Bottle
  • Manufacturer Part No: KL1602-1L
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Item Number: KEM-KL1602-1L
This item is discontinued. Please contact customer service at 512.836.1667 if you would like assistance finding an alternative item.

Details

KemLab™ KL 1602 Lift Off Photoresist is a negative photoresist with Lift-Off profile for i-Line, and broadband applications. It has a wide process window for consistency across substrates, while still retaining ability to adjust resist profile. Customization is available to adjust lift-off angle or adjust photo speed.

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KemLab™ KL 1602 Lift Off Photoresist is a negative photoresist with Lift-Off profile for i-Line, and broadband applications. It has a wide process window for consistency across substrates, while still retaining ability to adjust resist profile. Customization is available to adjust lift-off angle or adjust photo speed.

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