KemLab™ KL1602 Negative Lift Off Photoresist, 2 to 4um Film Thickness, 1L Bottle
Item Number:KEM-KL1602-1L
Manufacturer Part No:KL1602-1L
Manufacturer:KemLab
Units:1L Bottle
Details
- Designed for use with industry standard developers
- Film Thickness Range: 2 to 4 microns. ~Viscosity (cst): 25. Improved resolution. Wider Process Latitude.
- Wide process window for consistency across substrates, while still retaining ability to adjust resist profile
- Soft-bake on contact hotplate: 110°C for 60 seconds
- KL1602 is suitable for i-Line and broadband exposure
- 1L Bottle
KemLab™ KL 1602 Lift Off Photoresist is a negative photoresist with Lift-Off profile for i-Line, and broadband applications. It has a wide process window for consistency across substrates, while still retaining ability to adjust resist profile. Customization is available to adjust lift-off angle or adjust photo speed.
Documents & Videos
KemLab™ KL 1602 Lift Off Photoresist is a negative photoresist with Lift-Off profile for i-Line, and broadband applications. It has a wide process window for consistency across substrates, while still retaining ability to adjust resist profile. Customization is available to adjust lift-off angle or adjust photo speed.