KemLab™ KL1604 Negative Lift Off Photoresist, 3 to 6um Film Thickness, 1L Bottle
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- Designed for use with industry standard developers
- Film Thickness Range: 3 to 5 microns. ~Viscosity (cst): 67. Improved resolution. Wider Process Latitude.
- Wide process window for consistency across substrates, while still retaining ability to adjust resist profile
- Soft-bake on contact hotplate: 110°C for 60 seconds
- KL1604 is suitable for i-Line and broadband exposure
- 1L Bottle
- Manufacturer Part No: KL1604-1L
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Details
KemLab™ KL 1604 Lift Off Photoresist is a negative photoresist with Lift-Off profile for i-Line, and broadband applications. It has a wide process window for consistency across substrates, while still retaining ability to adjust resist profile. Customization is available to adjust lift-off angle or adjust photo speed.
Documents & Videos
KemLab™ KL 1604 Lift Off Photoresist is a negative photoresist with Lift-Off profile for i-Line, and broadband applications. It has a wide process window for consistency across substrates, while still retaining ability to adjust resist profile. Customization is available to adjust lift-off angle or adjust photo speed.