KemLab™ K-PRO™ 7-CS Advanced Packaging Thick Positive Photoresist, 7um Film Thickness (Case of 4 x 4L Bottles)
- Tone: Positive; Sensitivity: i-Line, g-Line & Broadband; Developers: Remover: NMP or DMSO.
- Designed for use with metal-ion or metal ion-free developers. Either TMAH- or KOH-Based Developers are ideal.
- Film Thickness: 7 microns
- Softbake: 115°C for 3 min (7µm). Broadband Aligner Exposure: 125 mJ/cm2. No PEB necessary.
- Competes with AZ 4000 positive photoresist. Applications: Advanced Packaging, Plating, TSV and Bumping.
- Case of 4 x 4L Bottles
- Manufacturer Part No: KPRO7-CS
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Details
KemLab™ K-PRO™ 3 is an advanced packaging positive resist for use in i-line, g-line and broadband packaging applications. This positive photoresist is compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.
Documents & Videos
KemLab™ K-PRO™ 3 is an advanced packaging positive resist for use in i-line, g-line and broadband packaging applications. This positive photoresist is compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.