KemLab™ KL 6003-CS General Purpose Positive Thick Photoresist, 2 to 5um Film Thickness (Case of 4 x 4L Bottles)

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  • Designed for use with industry standard 0.26 N TMAH developers
  • Film Thickness: 2 to 5 microns
  • Suitable for i-Line, broadband or g-Line exposure.
  • Soft-Bake (3um): 105°C for 90 seconds
  • Competes with Dow® MEGAPOSIT™ SPR220-3.0™ Series i-Line Photoresist and S1827 Positive Photoresist.
  • Case of 4 x 4L Bottles
  • Manufacturer Part No: KL6003-CS
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Item Number: KEM-KL6003-CS

Details

KemLab™ KL 6003 is a positive photoresist for use in i-Line, g-Line and broadband applications. KL 6003 offers high sensitivity, high throughput, and excellent process latitude.

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KemLab™ KL 6003 is a positive photoresist for use in i-Line, g-Line and broadband applications. KL 6003 offers high sensitivity, high throughput, and excellent process latitude.

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