KemLab™ KL NPR 2-500mL Straight Wall Negative Photoresist, 2um Film Thickness, 500mL Bottle
- May be used with industry standard 0.26 N TMAH and KOH developers. Industry standard NMP and DMSO-based removers recommended.
- Film Thickness: 4 micron; Tone: Negative; Sensitivity: Broadband and i-Line.
- Coat: Spin @ 2000rpm for 45-sec; Softbake: 90-sec @ 110°C; Exposure (Broadband on Si): 50 mJ/cm2; PEB: 90-sec @ 110°C; Develop (0.26N TMAH): 30-Seconds.
- KemLab™ KL NPR negative photoresist adheres to a variety of substrates including silicon, gold, glass, aluminum, and chromium.
- Not recommended for use on copper substrates.
- 500mL Bottle
- Manufacturer Part No: KLNPR2-500ML
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Details
KemLab™ KL NPR Straight Wall Negative Photoresist is a negative tone, novolac photoresist designed for electroplating, metal deposition, TSV, and RIE etch. It has a single coat film thickness of up to 20um and features vertical sidewalls and high aspect ratios. KemLab™ KL NPR negative photoresist is thermally stable and can withstand temperatures up to 130°C without profile degradation.
Documents & Videos
KemLab™ KL NPR Straight Wall Negative Photoresist is a negative tone, novolac photoresist designed for electroplating, metal deposition, TSV, and RIE etch. It has a single coat film thickness of up to 20um and features vertical sidewalls and high aspect ratios. KemLab™ KL NPR negative photoresist is thermally stable and can withstand temperatures up to 130°C without profile degradation.