KemLab™ KL NPR 6-CS Straight Wall Negative Photoresist, 6um Film Thickness (Case of 4 x 4L Bottles)

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  • May be used with industry standard 0.26 N TMAH and KOH developers. Industry standard NMP and DMSO-based removers recommended.
  • Film Thickness: 1 micron; Tone: Negative; Sensitivity: Broadband and i-Line.
  • Coat: Spin @ 2000rpm for 45-sec; Softbake: 90-sec @ 110°C; Exposure (Broadband on Si): 70 mJ/cm2; PEB: 90-sec @ 110°C; Develop (0.26N TMAH): 60-Seconds.
  • KemLab™ KL NPR negative photoresist adheres to a variety of substrates including silicon, gold, glass, aluminum, and chromium.
  • Not recommended for use on copper substrates.
  • Case of 4 x 4L Bottles
  • Manufacturer Part No: NPR-6-CS
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Item Number: KEM-NPR-6-CS

Details

KemLab™ KL NPR Straight Wall Negative Photoresist is a negative tone, novolac photoresist designed for electroplating, metal deposition, TSV, and RIE etch. It has a single coat film thickness of up to 20um and features vertical sidewalls and high aspect ratios. KemLab™ KL NPR negative photoresist is thermally stable and can withstand temperatures up to 130°C without profile degradation.

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KemLab™ KL NPR Straight Wall Negative Photoresist is a negative tone, novolac photoresist designed for electroplating, metal deposition, TSV, and RIE etch. It has a single coat film thickness of up to 20um and features vertical sidewalls and high aspect ratios. KemLab™ KL NPR negative photoresist is thermally stable and can withstand temperatures up to 130°C without profile degradation.

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