Versum Materials J204 Dynastrip™ 7700 Multi-Purpose Photoresist Remover, 1-Gallon Bottle (Case of 4)
Notice: Hazardous chemicals and products will incur additional Hazmat Fees and/or mandatory shipment via LTL Motor Freight
Please see the TECHNICAL DATASHEET for Dynastrip™ 7700 Multi-Purpose Photoresist Remover located in the "Documents" sub-tab below.
- Designed specifically for stripping thick photoresist (dry film or liquid) used in waver level packaging (WLP) including lead-free solder bumping, u-buping and Cu pillar.
- Materials Removed: Asahi Sunfort™ CX-A240, TOK 5104, JSR THB151N and other thick negative photoresists
- Multi-metal safe. Completely dissolves most photoresist types. Compatible with most WLP substrates.
- High bath loading capabilities. High flash point.
- May be used in either spray or immersion processes.
- Case of 4 x 1-Gallon Bottles
- Manufacturer Part No: 2303007
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Details
Dynaloy Dynastrip™ 7700 by Versum Materials is a uniquely formulated photoresist remover designed specifically for stripping thick resist (dry film or liquid) used in wafer level packaging (WLP) including lead‐free solder bumping, micro‐bumping and Cu pillar (Copper pillar).
Documents & Videos
Dynaloy Dynastrip™ 7700 by Versum Materials is a uniquely formulated photoresist remover designed specifically for stripping thick resist (dry film or liquid) used in wafer level packaging (WLP) including lead‐free solder bumping, micro‐bumping and Cu pillar (Copper pillar).