KemLab™ K-PRO™ 15-1L Advanced Packaging Thick Positive Photoresist, 15 to 25um Film Thickness, 1L Bottle
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Item Number:KEM-KPRO15-1L
Manufacturer Part No:KPRO15-1L
Manufacturer:KemLab
Units:1L Bottle
Details
- Tone: Positive; Sensitivity: i-Line, g-Line & Broadband; Developers: Either TMAH- or KOH-Based; Remover: NMP or DMSO.
- Designed for use with metal-ion or metal ion-free developers.
- Film Thickness Range: 15 to 25 microns
- Softbake: 115°C for 4 min (15µm) or 115°C for 4 min (25µm). Broadband Aligner Exposure: 210 mJ/cm2 (15µm) or 380 mJ/cm2 (25µm). No PEB necessary.
- Competes with AZ 4260 positive photoresist. Applications: Advanced Packaging, Plating, TSV and Bumping.
- 1L Bottle
KemLab™ K-PRO™ 15 is an advanced packaging positive resist for use in i-line, g-line and broadband packaging applications. This positive photoresist is compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.
Documents & Videos
KemLab™ K-PRO™ 15 is an advanced packaging positive resist for use in i-line, g-line and broadband packaging applications. This positive photoresist is compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.