KemLab™ K-PRO™ Advanced Packaging Thick Positive Photoresists

KemLab™ K-PRO™ photoresists are advanced packaging positive photoresists for use in i-line, g-line and broadband packaging applications. These positive photoresists are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.

Cover 5 to 25um in a single coat. Double-coat prcess available for up to 50um. Designed for us with either metal ion or metal-ion-free photoresist developers. No PEB required.